HOME » Thermal Interface Materials (TIMs) » Thermal Phase Change Materials (PCM) » MU-C35 Thermally Conductive Phase Change Material | MUSSE
MU-C35
The MUSSE MU-C35 Thermally Conductive Phase Change Material represents a major advancement in thermal interface technology for dense, high-heat electronic assemblies. Engineered as a convenient, 100% solid sheet at room temperature, it provides clean, efficient installation without the mess, migration, or pump-out issues typical of traditional thermal grease. Formulated with a specialized hyper-branched polymer structure and packed with high-performance aluminum ball fillers, the MU-C35 achieves a highly competitive thermal conductivity of 3.5 W/mK and an exceptionally low thermal impedance of 0.019 °C-in²/W.
Upon reaching its designated phase change activation threshold of 48°C, the sheet softens to conform perfectly to the microscopic surface irregularities of CPUs, GPUs, power transistors, and heatsinks. This optimization forces out trapped air, forming a uniform, ultra-thin bond line that drastically cuts overall thermal path resistance. Critically, with a siloxane volatile rating of 0%, this material prevents silicone outgassing, protecting sensitive internal electronics from lens fogging and contact degradation. Manufactured with precision in Taiwan, the MU-C35 stands out as a reliable, high-yield drop-in replacement for Henkel PXF series materials across demanding aerospace, automotive, and telecommunication systems.
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