Thermally Conductive Soft Gel Pad | Ultra-Soft Thermal Gap Fillers Taiwan | MUSSE TECHNOLOGY | Taiwan PPE & Industrial Safety Equipment Supplier

Name: MU-P45 Thermally Conductive Soft Gel Pad | 4.5 W/mK Thermal Interface Gap Filler Pad | MUSSE
Brand: MUSSE
SKU: MU-P45
Availability: InStock

Item

Description

The MU-P45 is a soft, thermally conductive gel pad designed to fill gaps and improve heat transfer between heat-generating components and metal heat sinks in electronic devices. It combines good thermal conductivity with electrical insulation, conducting heat away from components while maintaining an insulating barrier between the heat source and the heat sink or metal surface.

Free from harmful substances, the pad is soft and highly compressible, allowing it to conform to uneven surfaces and deliver a sealing and cushioning effect. It offers high temperature resistance, fire resistance and resistance to oxidation and corrosion, making it suitable for a range of demanding thermal management applications. Made in Taiwan.

Key Characteristics

High Thermal Conductivity Provides 4.5 W/mK thermal conductivity for effective heat transfer.
Thermal Conductivity with Electrical Isolation Transfers heat while maintaining electrical insulation between the heat source and metal surfaces.
High Bond Strength to Surfaces Adheres well to component and heat sink surfaces for reliable contact.
Soft and Highly Compressible Conforms to uneven surfaces for a sealing and cushioning effect.
High Temperature Stability Rated for an application temperature range of -50 to 200 degrees C.
Voltage Resistance Offers a breakdown voltage of 16 KV/mm and high volume resistivity.
UL94 V-0 Flammability Rating Meets the UL94 V-0 flammability classification.
Free from Harmful Substances Formulated without harmful substances for safer use.

Applications

IC, CPU, GPU and MOS components
LED modules and motherboards (M/B)
Power supply units (PSU) and power supplies (PS)
Heat sinks and computer cases
LCD-TVs, notebooks (NB) and PCs
HDDs, DDR modules, DVD drives and other electronics

Comparable Products

The MU-P45 can be considered as an alternative to comparable thermal gap pads, including Fujipoly GR45A / GR-m, Laird Tflex 700 and Bergquist GP series.

Specification of MU-P45 Thermally Conductive Soft Gel Pad

Property	Value	Test Method
Color	Gray	Visual
Thickness	0.5 to 3.0mm	ASTM D374
Specific gravity	3.23 g/cm3	ASTM D792
Hardness	Asker C 25 to 30; Shore 00 45 to 55	JIS K7312 / ASTM D2240
Thermal impedance at 0.5mm	0.22 (degrees C-in2/W)	ASTM D5470
Thermal conductivity	4.5 W/mK	Hot Disk
Volume resistivity	Greater than 10^13 Ohm-cm	ASTM D257
Breakdown voltage	16 KV/mm	ASTM D149
Dielectric constant	8	ASTM D150
Application temperature	-50 to 200 degrees C	-
Tensile strength	23	ASTM D149
Elongation	50%	ASTM D149
Siloxane volatiles (D4 to D20)	Less than 0.005%	-
Flammability	UL94 V-0	UL94
Origin	Made in Taiwan	-

Frequently Asked Questions

Q: What is the thermal conductivity of the MU-P45?

A: The MU-P45 has a thermal conductivity of 4.5 W/mK, providing effective heat transfer between components and heat sinks.

Q: Is the MU-P45 electrically insulating?

A: Yes. The MU-P45 combines thermal conductivity with electrical insulation, offering a volume resistivity greater than 10^13 Ohm-cm and a breakdown voltage of 16 KV/mm, so it transfers heat while maintaining an insulating barrier.

Q: What thickness range is available for the MU-P45?

A: The MU-P45 is available in thicknesses from 0.5 to 3.0mm, allowing it to fill gaps of different sizes between components and heat sinks.

Q: Which thermal pad products can the MU-P45 replace?

A: The MU-P45 can be considered as an alternative to comparable thermal gap pads such as Fujipoly GR45A / GR-m, Laird Tflex 700 and Bergquist GP series.

PRODUCTS

MU-P45 Thermally Conductive Soft Gel Pad | 4.5 W/mK Thermal Interface Gap Filler Pad | MUSSE
MU-P45

Item

Description

Frequently Asked Questions

PRODUCTS

MU-P45 Thermally Conductive Soft Gel Pad | 4.5 W/mK Thermal Interface Gap Filler Pad | MUSSE MU-P45

Item

Description

Frequently Asked Questions

MU-P45 Thermally Conductive Soft Gel Pad | 4.5 W/mK Thermal Interface Gap Filler Pad | MUSSE
MU-P45